Developed to meet the rigid standards of the Semiconductor industry, H-Seals deliver Ultra High Vacuum performance 100% of the time, are high temperature and reactive-gas compatible and are easy to handle in the clean-room. H-Seals are completely interchangeable with standard elastomeric O-Rings. H-Seals are ideal for Semiconductor and Bio-Pharmacutical applications.
Practical Design
All critical sealing surfaces are recessed to prevent damage. The H-Seal and H-Gland are able to withstand handling errors such as dropping or sliding.
100% Yield
The assembly yield of Bostec’s H-Seal/H-Gland combination is guaranteed to be 100%.
Interchangeable
Bostec’s unique H-Gland allows direct interchangeability with elastomeric O-Rings and metal C Seals.
Self-aligning
Bostec’s H-Seal/H-Gland structure is inherently self-aligning, making component assembly easy and mistake-proof.
Low Compressive Force Requirement
Bostec’s H-Seals require only 20 - 50% of the compressive force necessary with traditional metal gaskets.
Seal Integrity Increases with Compression
When tightening, the more force that is applied, the stronger the seal becomes. Over compression will not damage H-Seal integrity.
Positive Stop
The raised H-Seal flange acts as a positive stop against over-penetration of the knife edge. Over-tightening will not damage the gland or the seal.
Knife Edge Design
The H-Gland contains an inner knife edge used to penetrate the H-Seal. The soft nickel seal is sacrificed, not the gland.
"As Machined" Gland
Highly polished surfaces are not required for the Bostec H-Gland because minor irregularities are absorbed by the soft nickel H-Seal. Consequently, a broad range of machined surfaces (16 Ra or better) are acceptable.
Repeatability
H-Glands measuring 0.75" OD or less can be resealed 50+ times. Larger glands, up to 14" OD, maybe resealed 15 times with no loss of performance.
Free License
When you purchase Bostec H-Seals, you are automatically licensed to manufacture the H-Gland. Bostec will also provide drawings and design assistance. |
